Supply and Delivery of Swept Laser Source for PIC Measurements 1550nm
University of Strathclyde · UKM82
This tender has closed (deadline was 25 August 2026). Similar contracts are published all the time — see the live supplies & equipment tenders or get alerts so you hear the day the next one lands.
What the buyer wants
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical…
Key facts
- Buyer: University of Strathclyde
- Deadline was: 25 August 2026
- Location: UKM82
- Published on: Public Contracts Scotland — read the official notice
- CPV: 38000000