Supply, Delivery and Installation of High Accuracy Motion Control and Imaging System
University of Strathclyde · UKM82
What the buyer wants
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical…
Key facts
- Buyer: University of Strathclyde
- Deadline: 7 September 2026
- Location: UKM82
- Published on: Find a Tender
- CPV: 38000000
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